Improvement in the heat dissipation of matrix LED headlamps for vehicles according to the thickness and thermal conductivity of thermal interface materials 2019

• Year of publication

  2019

• Author

  D. K. Lee, T. K. Kim, J. M. Lee, Y.-J. Cha, J. S. Kwak

• Journal

  Japanese Journal of Applied Physics

• Volume

  58

• Page

  SCCC20