Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications 2019
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Year of publication
2019
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Author
S. K. Oh, J. S. Lundh, S. Shervin, B. Chatterjee, D. K. Lee, S. Choi, J. S. Kwak, J.-H. Ryou
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Journal
Journal of Electronic Packaging
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Volume
141
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Page
020801