The effect of thin V insertion layer into Ta film on the performance of Ta diffusion barrier in Cu metallization 1999

• Year of publication

  2010년 이전

• Author

  J.S.Kwak, H.K.Baik, J.-H.Kim, S.-M.Lee, H.J.Ryu, J.H.Je

• Journal

  J. Appl. Phys.

• Volume

  85

• Page

  6898-6903