The effectiveness of a thin refractory metal layer inserted into a Ta film by ion-assisted deposition as a diffusion barrier between copper and silicon 1999
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Year of publication
2010년 이전
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Author
J.-H.Kim, S.-M.Lee, J.S.Kwak, H.K.Baik, H.J.Ryu, J.H.Je
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Journal
J. Korean Physical Society
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Volume
35
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Page
S349-S352