Improvement of Ta diffusion barrier performance in Cu metallization by insertion of thin Zr layer into Ta film 1998

• Year of publication

  2010년 이전

• Author

  J.S.Kwak, H.K.Baik, J.H.Kim, S.-M.Lee

• Journal

  Appl. Phys. Lett.

• Volume

  72

• Page

  2832-2834