The effectiveness of Ta prepared by ion-assisted deposition method as a diffusion barrier between copper and silicon 1997

• Year of publication

  2010년 이전

• Author

  B.-S.Kang, S.-M. Lee, J.S.Kwak, D.-S.Yoon, H.K.Baik

• Journal

  J. Electrochem. Soc.

• Volume

  144

• Page

  1807-1812